Senior Thin Film Process Engineer

Job description

OUR STORY

At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.

When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world.

Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential.

Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.

YOUR ROLE

As a Senior Process Engineer , you will be the technical owner of the Electro‑Chemical Plating (ECP) copper process on the LAM Novellus SABRE platform . You will drive process development and sustaining activities, working closely with equipment engineering to characterize hardware, resolve complex issues, and continuously improve process robustness, yield, and overall tool performance.

·  Develop, optimize, and sustain ECP Cu reinforcement / damascene fill processes on Novellus SABRE tools.
·  Define and tune recipes and hardware configurations to achieve target thickness, uniformity, fill performance, and defect levels.
·  Collaborate with PVD barrier/seed and integration teams to ensure strong linkage between upstream processes (Ti, TiN, CVD‑TiN, Cu seed, etc.) and downstream ECP performance.
·  Perform structured hardware and process characterization , including experiments on flow, contact design, waveform, and chemistry conditions.
·  Lead troubleshooting and excursion management , conduct systematic root‑cause analysis, and implement permanent corrective and preventive actions.

YOUR SKILLS & EXPERIENCES

·  Bachelor's or Master's degree in Electrical/Electronic Engineering, Microelectronics, Materials Science, Applied Physics, Chemical or Mechanical Engineering , or a related discipline.
·  3+ years of hands‑on experience with ECP copper processes on LAM Novellus SABRE systems in a semiconductor fab environment.
·  Solid knowledge of semiconductor manufacturing , vacuum technology , and thin‑film deposition , including PVD barrier/seed fundamentals.
·  Strong collaboration and communication skills: able to document and present findings clearly through technical reports, reviews, and data summaries; active participation in cross‑functional forums and project teams.
·  Proven problem‑solving capability , including advanced root‑cause analysis, failure‑mode identification, and implementation of robust, sustainable solutions.

ST is proud to be one of the 17 companies certified as a 2025 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.

To discover more, visit st.com/careers.