Offers “Hp”

Expires soon Hp

Process Engineer Photo Team Internship

  • Internship
  • Corvallis (Benton County)
  • Design / Civil engineering / Industrial engineering

Job description

Job Description(s)

The MEMS section from the Advanced Technology Platforms & Solutions in Corvallis, Oregon is looking for an intern pursuing a degree in one of these areas:

· Material Science
· Chemical Engineering
· Electrical Engineering
· Microelectronic Engineering
· Microsystems Engineering
· Imaging Science

*** Summer Internships can vary in time and depend on the availability of the student ***

HP Inc. is the leader in Inkjet Technology. We work to maintain this position while adding new technologies and innovative products to our portfolio. We invent, develop, and bring to market new technologies and capabilities as well as integrate these technologies into systems. Our focus is on printing and imaging technologies as well as pursuing broader alternative technologies and research with an eye toward commercial applications. We are dedicated to providing advanced innovative solutions to our partners and customers.

The emphasis is to develop, characterize, and stabilize MEMS fabrication processes used for the production of inkjet components. Our fab uses a variety of processes to create fluidic features for thermal inkjet devices. Processes include traditional photo, etch, and bond technologies as well as less common micromachining methods.

Responsibilities

· Optimize fab processes for quality and yield.
· Work with product development teams to translate new product specifications into manufacturable designs. Work with other development engineers through the prototyping phase.
· Integrate new designs into existing processes.
· Apply statistical process control (SPC) methodologies to monitor and improve production processes.
· Develop new processes and tooling capabilities to support next generation product development.
· Process improvements to measure and evaluate MEMS features.
· Define specification linkages between process, product and test throughout the development cycle.

NOTES :

· This is an Internship opportunity.
·  HP may not sponsor individuals for immigration benefits in this position

Desired profile

Skills And Qualifications

· 3 rd year of university completed.
· Actively Pursuing Bachelor's or Master's Degree in Material Science, Engineering (ChemE, MatSci, EE, Microelectronics, Microsystems), Imaging Science or Physical Sciences (Chemistry, Physics) with a research topic related to silicon or MEMS processing.
· Ability to work and interact effectively with team members from other disciplines, cultures, organizations and other companies both locally and remotely.
· Understanding of the fundamental physical and chemical mechanisms of wafer or MEMS processes.
· Strong written and spoken communication skills.
· Demonstrated leadership, teamwork/interpersonal, communication and technical skills.
· Ability to creatively solve problems in a fast-paced product development environment

Knowledge in one or more of the following:

· Semiconductor lithography processes
· Thin film etching
· Thin film depiction
· Metrology – CD SEM, Overlay, thin films, etc…
· Failure analysis and characterization
· Data Analysis and Statistical Process Control (SPC)

Desired :

· Knowledge with one or more of the following:
· JMP or other data analysis or statistical software.
· Project management fundamentals.
· Photolithography

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