Process Integration and Yield Engineer

Job description

Introduction
IBM Research takes responsibility for technology and its role in society. Working in IBM Research means you'll join a team who invent what's next in computing, always choosing the big, urgent and mind-bending work that endures and shapes generations. Our passion for discovery, and excitement for defining the future of tech, is what builds our strong culture around solving problems for clients and seeing the real world impact that you can make.

IBM's product and technology landscape includes Research, Software, and Infrastructure. Entering this domain positions you at the heart of IBM, where growth and innovation thrive.

Your Role and Responsibilities
We are seeking a process integration and Yield engineer who can work in a highly multi-disciplinary, multi-cultural environment at our Albany research location. This candidate will be leading and supporting IBM research and development activities in semiconductor and/or superconducting circuit technology, focusing on process development and yield improvement. This individual will work to develop and mature novel processes and integration schemes to build innovative structures that demonstrate the desired performance and yield benefits for IBM hardware technologies.
·  Design and conduct experiments leveraging semiconductor process technology to optimize performance and yield
·  Track progress of hardware to ensure desired outcomes
·  Analyze data to determine best conditions to optimize the process
·  Identify issues and recommend solutions to improve performance and yield
·  Design macros and circuits to evaluate various layouts
·  Create Intellectual Property (IP) and publish learning
·  Condense and present analyses and reports
·  Identify and drive opportunities for operational and quality improvements

Required Technical and Professional Expertise

·  At least 2 years experience in microelectronics materials and process integration, chemistry or materials science research, and/or applied physics research.
·  Demonstrated understanding of device physics of semiconductors
·  In-depth knowledge of Process Integration of semiconductor devices
·  Demonstrated understanding of Yield and Electrical Characterization
·  Ability to independently troubleshoot and solve complex problems
·  Ability to communicate and work with a dynamic interdisciplinary team composed of electrical engineers, fabrication engineers and experimental physicist
·  Strong presence and organization within team

Preferred Technical and Professional Expertise

·  Good understanding of Design and Electrical test setup
·  Good understanding of defect Yield pareto build
·  At least 5 years experience in microelectronics materials, process integration and device characterization
·  At least 3 years experience in Far Back End of Line (FBEOL) / 3D Integration / Chip Packaging
·  Experience with fabrication processes for superconducting materials
·  Understanding of Simulation/Emulation