Etch Process Research & Development Engineer

Job description

IBM's Strategic Patterning Research group at Albany Nanotech is currently seeking engineers in the area of plasma etch for advanced patterning, including multiple patterning, EUV, and DSA.

The hired candidates will have significant expertise in the area of reactive ion etch or a similar field.

Some of the job responsibilities include the development of advanced patterning sequences and analysis of patterning performance. The candidates must understand the fundamental principles of reactive ion etch processes, and will define the path for leading patterning methodologies from concept through implementation. The positions require interaction with cross-functional and multi-company working teams that include engineers engaged in unit process development, process integration, design/layout, materials and process development, and computational technology. Generation of Intellectual Property for IBM and protection of it through the patenting process are also expected. The hired candidates must possess strong analytical and design-of-experiment knowledge, excellent written and verbal communication skills, and the ability to articulate difficult concepts to an audience with diverse technical backgrounds.

Auto req ID

97402BR
Required Education

Bachelor's Degree
Role ( Job Role )

Unit Process Engineering Professional
State / Province

NEW YORK
Primary job category

Hardware Development & Support
Contract type

Regular
Employment Type

Full-Time
Is this role a commissionable/sales incentive based position?

No
Travel Required

No Travel
IBM Business Group

Research
Preferred Education

Doctorate Degree
City / Township / Village

ALBANY
EO Statement

IBM is committed to creating a diverse environment and is proud to be an equal opportunity employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, gender, gender identity or expression, sexual orientation, national origin, genetics, disability, age, or veteran status. IBM is also committed to compliance with all fair employment practices regarding citizenship and immigration status.
Required Technical and Professional Expertise

·  3-5 years of hands-on process development experience in plasma etch, plasma-assisted deposition, or a closely related field. Industrial experience is preferred, though academic research will be considered.
·  Familiarity with process flows for fabrication of semiconductor devices or similar products.
·  Applied experience in design and interpretation of process development experiments, including the interpretation of SEM, TEM, or similar images.

Country

United States
Preferred Technical and Professional Experience

·  Application of statistical analysis and statistical process control to manufacturing processes.
·  >1 year experience in improvement of yields and robustness of fabrication processes.
·  >1 year involvement in development of integrated patterning processes, combining lithography or some other method of pattern generation with etch or other processes for transferring those patterns to other materials.
Secondary Job Category

Hardware Engineer
Eligibility Requirements

·  none
Position Type

Professional
Early Professional Track

Not Applicable - Professional Hire
New Collar Role

No