Thermal and Mechanical Package Simulation Engineer - Temporary 2-year Contract (f/m)
Befristeter vertrag Munich (Upper Bavaria) Design / Civil engineering / Industrial engineering
Job description
In this position, you will join a Simulation Engineering team within Intel contributing to wireless communication semiconductor products like baseband processors, transceivers, power management ICs and system on chips. Your responsibilities will include:
-Applying mechanical and thermo-mechanical FEA and CAD methods to analyze the thermal properties and behavior of packaged chips in typical product applications
-Applying the same methods to analyze, develop and specify package related design rules and to characterize the thermal and mechanical features of packages
-Assessing design and hardware limitations of products related to thermal properties of packaged chips in typical product applications and help to develop appropriate product and platform characterization and verification methods
-Developing simulation and modeling methods for thermal analysis of packaged chips and perform parametric studies
-Developing utility programs for interfacing and processing of input and output data of the applied software tool
Desired profile
You should possess a Master or Diploma degree in Mechanical or Electrical Engineering or Physics. Two years experience in simulation support of development in semiconductor industry or an equivalent Ph.D. program and/or equivalent training are favorable but not required.
1.Knowledge
-Good knowledge in numerical simulation of thermal and thermo-mechanical effects in single and multi-chip packages, on printed-circuit boards and in reference systems
-Knowledge of chip interconnect & package manufacturing with emphasize on state of the art flip-chip (FC), wafer-level ball grid array (WLB) and wafer-level chip size (WLCSP) package technologies
-Knowledge of some of the following software tools: Mentor Graphics FloTHERM, ANSYS Mechanical and IcePAK, or Simulia Abaqus
-Good knowledge of UNIX / Linux and typical scripting languages
2.Skills
Experience as a technical team member in development projects