Thermal and Mechanical Package Simulation Engineer (f/m)

Job description

Join Intel—and engineer the future.

Intel is in the midst of an exciting transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth. So join us—and help us create the next generation of technologies that will shape the future for decades to come.

In this position, you will join a Simulation Engineering team within Intel contributing to wireless communication semiconductor products like baseband processors, transceivers, power management ICs and system on chips. Your responsibilities will include:

What you'll do

In this position, you will handle various responsibilities:

- Applying mechanical and thermo-mechanical FEA and CAD methods to characterize and analyse the thermal and mechanical properties and behaviour of packaged chips on reference boards and in typical product applications

- Applying the same methods to analyse, develop and specify package related thermal and mechanical design rules

- Assessing design and hardware limitations of products related to thermal properties of packaged chips in typical product applications and help to develop appropriate product and platform characterization and verification methods

- Developing simulation and modelling methods for thermal analysis of packaged chips and perform parametric studies

- Developing utility programs for interfacing and processing of input and output data of the applied software tool

Desired profile

Must have

- You should possess a Master or Diploma degree in Mechanical or Electrical Engineering or Physics. A minimum of 3 years' experience in simulation support of development in semiconductor industry or an equivalent Ph.D. program and/or equivalent training are required.

- Deep knowledge in numerical simulation of thermal and thermo-mechanical effects preferably in single and multi-chip packages, on printed-circuit boards and in reference systems

- Good Knowledge of chip interconnect & package manufacturing with emphasize on state of the art flip-chip (FC), wafer-level ball grid array (WLB) and wafer-level chip size (WLCSP) package technologies

- We expect experience as a technical team member in international development projects, with proven problem solving and strong communication skills (English: fluent, German: favourable).

Nice to have

- Deep Knowledge of some of the following software tools: Mentor Graphics FloTHERM, ANSYS Mechanical and IcePAK, or Simulia Abaqus

- Good knowledge of UNIX / Linux and typical scripting languages

What we offer you

- We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth.

- As a global leader in innovation and new technology, we foster a collaborative, supportive, and boredom-free environment—where the brightest minds in the world come together to achieve exceptional results.

- We offer a competitive salary and financial benefits such as bonuses, retirement plans, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation).

- We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs and amenities, flexible work hours, time off, recreational activities, discounts on various products and services, and many more creative perks that make Intel a Great Place to Work!

We're constantly working on making a more connected and intelligent future, and we need your help. Change tomorrow. Start today.