Optical System Design Engineer

Job description

Job Description

As an Optical Design Engineer, you'll be part of Intel's Silicon Photonics team that is leading the 400G-market transition and driving innovation for next generation of optical interconnect products. You will collaborate with multiple teams to develop the product that meets or exceeds product requirements. In this role, your responsibilities will include, but not be limited to the following:- As a team member in developing packaging design for state of the art Silicon Photonics SiPh devices and assemblies, with emphasis on mirco-optics, optoelectronic component and sub-systems.- Drive the package designs and technology selection by assessing and mitigating risks associated with the product designs.- Partner with stakeholders to identify new suppliers for design, develop and manage existing suppliers. Interact with suppliers and optimize designs based on supplier's processes and capabilities.- Work with cross-functional groups to determine package requirements. Design from concept to volume production to meet the electrical, optical, mechanical, thermal, and reliability requirements.- Perform tolerance analysis of opto-mechanical components and subassemblies. - Generate optical and opto-mechanical component specifications, layouts, assembly drawings for product and tooling. - Design optical systems and optimize design thru. optical simulation.- Lead or support developing assembly and test method to validate the design. - Define inspection and validation methods to test optical component and systems performance- Work with Manufacturing Ops team on managing and developing the full Bill of Materials, and analyzing data to optimize yield.We look forward to meeting you and having you join our growing team!

Inside this Business Group

The Data Center Group (DCG) is at the heart of Intel's transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

Desired profile

Qualifications

Minimum Qualifications:

Minimum BS degree in related engineering field

3+ years of experience in the photonics or semiconductor or related industry

Basic understanding of transceiver module assembly processes-

Expertise in Zemax or other optical simulation software, including running Monte Carlo simulations to evaluate optical designs and validating them to reality

Preferred Qualifications:

NPI/Process development skills, transfer process development learning, problem-solving and manufacturing yield improvement at CM in Asia

Proficiency in opto-packaging design including design of fixtures, tolerance stack management through intelligent fixture design, alignment tools to enable intelligent active and passive alignment processes

Experienced in designing and qualifying high volume single mode TOSA and ROSA products, specify sub-component lens, isolator, WDM MUX/DEMUX, fiber assembly, etc. specifications including tolerances

Hands on process development experience for optical alignments - lens and fiber, UV & thermal epoxy curing, epoxy bond line control, flip chip die bonding, wire bonding of laser and photodiode chips on substrate, solder processes, etc.

Solid knowledge of incoming and outgoing QC metrology to guarantee known good designs entering assembly line

Hands on experience on product manufacturing yield improvement and quality control with SPC such as Cpk, GR&R, Pareto chart, failure and data analysis

Proven track record in product design and development cycle from initial conceptual design to high volume production is highly desirable

Detail oriented problem solver, sense of urgency and commitment to achieve targeted goals. Team player with good verbal and written communication and interpersonal skills.

Ability to work independently as well as in a team environment across functional and organizational boundaries.

Demonstrated ability to juggle multiple priorities and deliver against a schedule. - Working knowledge with product documentation, schematics, and Bill of Materials.

Ability to use I2C and other protocols to communicate with EICs to enable test development for opto-packaging process

Ability to collect manufacturing wafer to module test correlation data and perform SPC analysis JMP or Python scripting strongly preferred

Programming experience using Labview, C/C++, ability to define alignment algorithms, test methods, etc.

Hands on experience in the test system and software development with advanced test equipment such as optical spectrum analyzer OSA, digital communications analyzer DCA, high frequency O/E converter, high speed oscilloscope, RF amplifiers, etc.

Expertise in designing experiments to complete reliability assessment and failure analysis during process development, define path for product and process meeting datacenter lifetime requirements.

Familiar with Telcordia standards such as GR-468 and GR-1221 optoelectronic devices and optical passive components

Intel® Silicon Photonics Product Division (SPPD) is at the forefront of silicon photonics integration. Since announcing the world's first hybrid silicon laser nearly a decade ago, our team continues to lead the industry with cutting-edge technology and efficient, scalable high-volume manufacturing. Our dedication to advanced development ensures that Intel Silicon Photonics continues to drive future data center bandwidth growth with smaller form factors and higher speeds, from 100G today to 400G and beyond tomorrow. We are looking for great talent to accelerate this journey, so if you are interested in joining our leading organization, then we want to hear from you!