Package Design Engineer

Job description

Job Description

Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages. Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design. Conducts tests and research on basic materials and properties. Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment.

As Package design lead, the successful candidate would be responsible for executing Package product designs . He/She will be enabling technical aspects of the Package design process including conducting early route studies, creation of specifications, providing guidance for electrical analysis and design layouts. Job function also involves managing design schedules, conducting design reviews and guide in package tape out process. As package design lead, the candidate will also work closely with other stakeholders from different organizations within the company to incorporate their inputs into the PKG design.

The ideal candidate should exhibit the following behavioral traits :

·  Proven Team player Strong communication and stakeholder management skills

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Other Locations

US, Oregon, Hillsboro

Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.

Desired profile

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

·  Bachelors/Master's in Electrical, Mechanical Engineering, Materials Science or related disciplines.
·  Prior experience 1 yr or more with physical design Package/PCB or Computer Aided Design CAD.

Additional Preferred Qualifications:

·  Experience in Package/Substrate technology development Familiarity with design tools like Cadence and/or Mentor Graphics and other CAD design tools.
·  Familiarity with Package layout extraction and Electrical modeling/simulation tools such as PowerDC, Hyperlynx, Q3D, and HFSS Interest in scripting languages such as Perl, VB.