NAND Product Quality and Reliability Engineer

Job description

Job Description

In this position, you will be working as a member of the Non-Volatile Memory NVM Solutions Group's NSG's Technology Development Quality and Reliability team, helping to develop Intel's new emerging NVM technologies such as 3D NAND and 3D Xpoint TM and SSD products, focusing on NVM reliability.

Your responsibilities will include but not limited to:

- Determining reliability requirements and technology targets of components and systems to achieve company, customer and other reliability objectives.

- Designing and executing experiments to identify, segment, characterize and model NVM reliability mechanisms.

- Developing empirical and physics.

- Based predictive reliability modeling methods and tools for reliability risk assessments.

- Developing new acceleration techniques, test methods and analytical tools to provide fast and effective feedback for reliability process optimization.

- Influencing design, process, product, test and/or system solutions in order to enable aggressive scaling of Intel's NVM technologies and exploration of novel memory cells.

- Developing the appropriate process- and product-qualification stress methods and criteria.

- You may be expected to lead small cross-functional and cross-company groups of engineers on multi-disciplinary technical projects to solve complex reliability issues such as, during technology development and ramp to high-volume manufacturing.

The successful candidate should exhibit behavioral traits such as:

- Systematic analytical problem solving.

- Creativity and innovation in solving technical problems.

- Affinity for cross-disciplinary work performance skills.

- Demonstrated attention to details and quality of the work.

- Persistence and commitment to task.

- Ability to clearly communicate achieved results and to influence wide range of audiences.

- Demonstrated leadership to assume the authority and advocate for new ideas.

Inside this Business Group

Employees in Intel's NVM Solutions Group deliver solutions that are transforming computing across all segments from data centers to Ultrabooks. They invent, develop, bring to market and support customers with leading-edge NAND flash memory and system level solutions such as solid state drives (SSDs). SSDs are accelerating performance for gaming enthusiasts, reducing total cost of ownership for IT managers of data centers and improving security and reliability for businesses. This dynamic group is strategically positioned to become the leading Non-Volatile Memory solution supplier for the compute segment and is a key to expanding markets and continuing the growth for Intel.

Desired profile

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Relevant experience can be obtained through school work, classes and project work, internships, military training, and/or work experience. This is an entry level position and will be compensated accordingly.

Minimum Qualifications

The candidate must possess a M.S. in Electrical Engineering, Computer Engineering, Materials Science, Physics or Information Systems Engineering.

Minimum 6 months of experience with:

• Device physics.
• Circuit design.
• Semiconductor processing.
• Programming C or C++, PERL or Python.

Preferred Qualifications

• The following areas of expertise will be considered as a plus for this position:
• Materials science.
• Probability and statistics.
• Quantum physics.
• Hands-on experimental design, execution, analysis, interpretation and synthesis.
• Non-volatile memories, especially product or reliability Experience with a range of analytical lab test equipment such as Logic analyzer/oscilloscopes, semiconductor parametric analyzer CV-IV, memory testers, SEM/TEM/IREM.
• Reliability failure statistics, physics, or failure mechanisms. CMOS transistor level circuit design, semiconductor device physics, memory reliability, interconnect reliability, computer or digital systems, or board level design.
• Statistical analysis packages R, JMP or Minitab Computer programming for testing, preferably of memories, and data acquisition, reduction and analysis.
• Semiconductor fabrication process, packaging assembly, and/or board system technology operation.