Assembly Process & Equipment Engineer

Job description

Job Description
This position carries the role of a Module Engineer, where responsibilities involved sustaining and developing a stable process & module tool performance as well as enabling new products (NPI). You will be collaborating closely with multiple functional groups such as Development Group, Factory Operations, Materials, and etc. to deliver factory required business goals. Must have the ability to resolve process/equipment issues in a structured manner and being a mentor to technicians.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Desired profile

You must possess an Engineering Bachelor's degree or above. Preferably a Master Degree in Mechanical/Materials Engineering with at least 3-4 years working experience in HVM Assembly Engineering environment. Possess strong hands-on skills on equipment, process, material & mechanical interaction problem solving in a structured manner. Experienced and have a good knowledge in Mechanical Placement, Vision, will be added advantages.Familiarity with change control process, excursion and quality management, new products/tool technology enabling. Possess excellent stakeholder management, verbal and written communication skills as well strong business acumen. Willingness to work on ad-hoc hours upon request when in equipment/process excursion mode