Failure Analysis Engineer – Early Career

Job description

Description
Perform non destructive and destructive analysis of electronic components and assemblies for HP’s businesses in order to determine root cause of failures. Work with the businesses and other reliability engineers to recommend corrective actions in order to prevent failure recurrence. The individual will require use of a variety of analytical equipment including scanning electron microscopy, energy dispersive x-ray, Fourier transform infrared spectrometry, gas chromatography/mass spectrometry, scanning acoustic microscopy, real time X-ray, optical microscopy and chemical decapsulation equipment. Cross sectioning of assemblies/components will also be necessary using metallographic sanding and polishing equipment. On some occasions, reliability stress testing of the electronics within environmental chambers will also be required.

Desired profile

Education and Experience:
Bachelor's or Master's degree in Mechanical, Electrical, Material Science or other comparable engineering discipline
Minimum 1 year of experience
Knowledge and Skills
Prior exposure to root cause failure analysis methodologies
Prior exposure to failure analysis analytical equipment mentioned above
Previous experience with cross sectioning of electronic assemblies/components
Evidence of excellent verbal and written communication skills
Evidence of excellent teamwork skills as this position will involve working with a host of product, failure analysis and
reliability engineers