Offers “STMicroelectronics”

Expires soon STMicroelectronics

Senior / Engineer, Mechanical Design (Imaging R&D) M/F

  • Pacific (Franklin)

Job description

General information

Reference

2021-14674  

Job level

40 - Experienced

Position description

Posting title

Senior / Engineer, Mechanical Design (Imaging R&D) M/F

Regular/Temporary

Regular

Job description

Work Location : Ang Mo Kio BHQ at 5A Serangoon North Avenue 5 Singapore 554574

The Mechanical Design Engineer role involves the design of integrated circuit packaging suitable for use in Time of Flight (TOF) system. The packaging forms an integral part of the optical component integration and thermal management of the module.

It will require detailed mechanical design using CAD software (Solidworks) to explore concept designs, develop mass production designs optimized for external subcontractors manufacturing process tolerances.

The role will involve mechanical design for Time of Flight sensors, with the objective to produce well designed modules for mass production, including:

·  Responsible for mechanical package design for consumer electronics applications
·  Knowledge of FMEA lead design processes
·  Material and process selection
·  Detailed 2D drawings and 3D modelling
·  Knowledge of Finite Element Analysis for stress and thermal modelling
·  Co-operation with related disciplines including optical & product engineers
·  Design for high volume manufacture, assembly compatibility
·  Verifying mechanical design by simulation and characterization of parts

The role requires frequent interactions with various customers, vendors and other stake holders in multiple geographic locations. As such, a successful candidate is expected to work in various time zones and be able to travel at short notices.  Also, strong communication and presentation skill is needed.

 

Profile

The Key skills & ExperienceKey skill

·  Bachelor / Masters / PhD in Mechanical Engineering
·  Experience of collaborative design
·  CAD literacy in Solidworks or similar
·  Product Development Processes
·  Risk-based design approach (FMEA)
·  GDT and tolerance analysis
·  Experience in dealing with injection molding parts and vendors.
·  Strong communication skills both written and oral
·  Good interpersonal and Presentation skills
·  Strong communication and presentation skill
·  Good mechanical engineering fundamentals.

Ideal Knowledge and Experience

·  Finite Element Analysis
·  Thermal analysis
·  Computation Fluid Dynamics
·  Material science (Thermoset plastics)
·  Solid Mechanics 

Seniority of this position will commensurate with competence and experiences.

Position location

Job location

Asia-Pacific, Singapore, Ang Mo Kio

Candidate criteria

Education level required

4 - Bachelor degree

Experience level required

2-5 years

Languages

·  English (2- Business fluent)
·  Chinese (Mandarin) (1- Basic)

Requester

Desired start date

02/08/2021

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