Offers “STMicroelectronics”

Expires soon STMicroelectronics

Package Development BE M/F

  • Internship
  • Shenzhen, CHINA
  • Sales

Job description



General information

Reference

2019-1716  

Job level

40 - Experienced

Position description

Posting title

Package Development BE M/F

Regular/Temporary

Regular

Job description

- Project leader to follow the specific product development.

- Coordinate all related resource to ensure the smooth development of the new product. Align with the product timeline and meet customer's milestone.

- Regular review with the customer and crisis management.

- Essential internal/external communication. Including but not limited to timely information sharing between different function, regular review of the project execution.

- Advanced new product risk analysis (FMEA), process flow definition, management of material, equipment, process for new product development, qualification and volume ramp up.

- Process deep dive and trouble shooting to deliver robust, good quality and competitive cost product.

- New process bricks and  development

- Quality control and continuously improvement

Profile

- experienced in semi-conduct assy

- strong technical skills

- strong leadership and  communication skills (internal and external)

- familiar and skilled at SPC, FMEA, 8D, good at quality control

- experienced in project management and crisis management.

Position localisation

Job location

Asia-Pacific, China, Shenzhen

Candidate criteria

Education level required

4 - Bachelor degree

Experience level required

2-5 years

Languages

English (2- Business fluent)

Requester

Desired start date

01/08/2019