Packaging Thermal and Mechanical Simulation Engineer

Job description

Job Description

As a Package Thermal Engineer, you will working closely with product architecture, IC design and internal engineering communities to deliver product level thermal solutions for FPGA and System in Package solutions. You will work on developing the product level thermal solution based on application requirements, package materials and technology. Knowledge of modeling multi-die package solutions is a must. Standard modeling s/w skills include Flotherm, ICEPAK and Compact Thermal Models

Inside this Business Group

The Programmable Solutions Group (PSG) was formed from the acquisition of Altera. As part of Intel, PSG will create market-leading programmable logic devices that deliver a wider range of capabilities than customers experience today. Combining Altera's industry-leading FPGA technology and customer support with Intel's world-class semiconductor manufacturing capabilities will enable customers to create the next generation of electronic systems with unmatched performance and power efficiency. PSG takes pride in creating an energetic and dynamic work environment that is driven by ingenuity and innovation. We believe the growth and success of our group is directly linked to the growth and satisfaction of our employees. That is why PSG is committed to a work environment that is flexible and collaborative, and allows our employees to reach their full potential.

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