Analog Packaging Design Electrical Engineer

Job description

Job Description

Executes package designs across Intel's product portfolios as part of the Assembly and Test Technology Development group. Directs technical aspects of the Package design process including conducting early route studies, creation of specifications, providing guidance for electrical analysis and supervision of production layouts. Manages design schedules, conducts design reviews and guides in package tape out process.

As Analog Packaging Design Electrical Engineer, works closely with other stakeholders from different organizations within the company to incorporate their inputs into the package design. Post design validation data analysis to understand the packaging impact to product performance, yield and reliability. Needs to have the ability to learn and adapt to multiple CAD tools and other design software applications and develop robust and optimal design solutions through CAD layout using package design tools that meet all stakeholder requirements.Works on Signal Integrity and RF performance analysis and antenna design for IC packages and is responsible for the performance of those packages.

Responsible for the extraction, analysis, and optimization of the high performance interfaces for electronic components. Provides technical guidance tocircuit/package/boarddesigns to optimize system performance. Reviews electrical technical specifications and works with package design teams to assure package designs meet those specifications. Determines creative design approaches and parameters.

Should be a self-motivated engineer who has strong technical background in electrical analysis and design. Works with a cross functional team including silicon IP design, package and PCB platform to define and co-optimize the SI/PD solutions. Determines creative design approaches and solutions based on formal education and judgement, works with the design and layout teams to implement those solutions, and to verify the signaling and power performance through simulation.

The ideal candidate should exhibit the following behavioral traits:

·  Strong analytical ability and problem solving skills like: identifying, isolating, and debugging issues and providing creative solutions.
·  Ability to work independently and at various levels of abstraction.

Inside this Business Group

The Data Center Group (DCG) is at the heart of Intel's transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

Other Locations

US, Oregon, Hillsboro

Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.

Desired profile

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences. Minimum Qualifications: Possess a PHD in Electrical Engineering or a related discipline. Preferred Qualifications: Experience with circuit and electromagnetic simulation tools like: SPICE, Ansys tools HFSS, Q2D, Q3D, Cadence tools Allegro, Power SI, etc. Hands-on signal integrity and/or power integrity, or related experience in the actual product design. Good understanding of IC Packaging.