Advanced Technology Platforms & Solutions Internship

Job description

Job Description(s)
The MEMS section from the Advanced Technology Platforms
& Solutions in Corvallis, Oregon is looking for an intern pursuing a degree in one
of these areas:
Material ScienceChemical EngineeringElectrical EngineeringMicroelectronic EngineeringMicrosystems EngineeringImaging
Science
 
*** Summer Internships can vary in time and depend on the
availability of the student ***
 
HP Inc. is
the leader in Inkjet Technology. We work to maintain this position while adding
new technologies and innovative products to our portfolio. We invent, develop,
and bring to market new technologies and capabilities as well as integrate
these technologies into systems. Our focus is on printing and imaging
technologies as well as pursuing broader alternative technologies and research
with an eye toward commercial applications. We are dedicated to providing
advanced innovative solutions to our partners and customers.
The emphasis is to develop, characterize, and
stabilize MEMS fabrication processes used for the production of inkjet
components. Our fab uses a variety of processes to create fluidic features for
thermal inkjet devices. Processes include traditional photo, etch, and bond
technologies as well as less common micromachining methods.
 
Responsibilities
Optimize fab processes for
quality and yield.
Work with product
development teams to translate new product specifications into manufacturable
designs.  Work with other development engineers through the prototyping
phase.
Integrate new designs into existing
processes.
Apply statistical process
control (SPC) methodologies to monitor and improve production processes.
Develop new processes and
tooling capabilities to support next generation product development.
Process improvements to
measure and evaluate MEMS features.
Define specification
linkages between process, product and test throughout the development cycle.
 
NOTES:
This is an Internship
opportunity.
HP may not sponsor
individuals for immigration benefits in this position

Desired profile

Skills And Qualifications
3rd
year of university completed.
Actively Pursuing
Bachelor’s or Master’s Degree in Material Science, Engineering (ChemE, MatSci,
EE, Microelectronics, Microsystems), Imaging Science or Physical Sciences
(Chemistry, Physics) with a research topic related to silicon or MEMS
processing.
Ability to
work and interact effectively with team members from other disciplines,
cultures, organizations and other companies both locally and remotely.
Understanding
of the fundamental physical and chemical mechanisms of wafer or MEMS processes.
Strong
written and spoken communication skills.
Demonstrated
leadership, teamwork/interpersonal, communication and technical skills.
Ability to
creatively solve problems in a fast-paced product development environmentKnowledge in one or more of the following: Semiconductor lithography processesThin film etchingThin film depictionMetrology – CD SEM, Overlay, thin films, etc…Failure analysis and characterizationData Analysis and Statistical Process Control (SPC)
Desired:
Knowledge
with one or more of the following:JMP or
other data analysis or statistical software.
Project
management fundamentals.
Photolithography