Principal MM-Wave Packaging Engineer

Job description

DESCRIPTION

Project Kuiper is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world.

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The Role:
As Principal Mm-wave Packaging Engineer, you will engage with an experienced cross-disciplinary staff to conceive and design innovative product solutions. You will work closely with an internal inter-disciplinary team, and third party suppliers to drive key aspects of product definition, execution and optimization. You must be responsive, flexible and able to succeed within an open collaborative peer environment.

You will be responsible for package designs for mm-wave beamforming SoCs, modems and front-end modules for ground and space applications. For space, strong focus will be on creating the most power optimized solution for a given system performance while meeting a plethora of environmental constraints including shock/vibe, vacuum, high thermal cycles, long-term reliability, and heat management. For ground applications, the focus will shift to obtaining state-of-the-art mm-wave performance in ultra-low-cost packaging.

In this role you will:
· Collaborate with the mechanical, antenna, EE hardware, and ASIC teams on package materials selection, assembly process, design, and qualification of packages and other spacecraft parts interfacing with packages.
· Collaborate with digital design, and RF chip designers define package floorplans, bump maps, and ball maps for communications ICs.
· Work with package vendors on stack-ups, materials selection, package options, assembly process, and thermal testing/design.
· Analyze cost/performance trade-offs, and complete layout of package types such as FCBGA, WLCSP, QFN, etc.
· Setup and run 3D electromagnetic simulations of package + PCB in tools such as HFSS and Momentum to verify your designs and designs from external vendors.
· Perform signal integrity checks and create models for packages to identify issues like crosstalk and coupling.
· Assist the thermal team in defining and running thermal simulations of packages and PCBs.

Export Control Requirement:
Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.

PREFERRED QUALIFICATIONS

· 15+ years of experience designing full-custom packages/PCBs for high performance chips.
· Understanding of package materials properties related to high-volume production: temperature cycling, ball stress, outgassing, etc.
· Technical leadership of teams of designers with cross-functional backgrounds in electrical engineering, mechanical engineering, and full-custom ASIC design.
· Strong understanding of RF fundamentals such as s-parameters, impedance matching, and passive components such as couplers and transmission lines.
· Experience designing high-speed, high pin count digital interfaces (e.g. SERDES, CPU, memory).
· Strong written and verbal skills

Desired profile

BASIC QUALIFICATIONS

· Masters or PhD degree in Electrical Engineering, Mechanical Engineering, Materials Science, or related field, or equivalent experience.
· 15+ years of experience in RF design, preferably in an advanced node
· Proven track record where products have gone to volume production
· Hands on experience with RF communication systems